CUS06 2010-02-01 1 toshiba schottky barrier rectifier schottky barrier type CUS06 switching mode power supply applications portable equipment battery application ? forward voltage: v fm = 0.45 v (max) @i f = 0.7 a ? average forward current: i f (av) = 1.0 a ? repetitive peak reverse voltage: v rrm = 20 v ? suitable for high-density board a ssembly due to the use of a small surface-mount package, us ? flat tm absolute maximum ratings (ta = 25c) characteristics symbol rating unit repetitive peak reverse voltage v rrm 20 v average forward current i f (av) 1.0 (note 1) a peak one cycle surge forward current (non-repetitive) i fsm 20 (50 hz) a junction temperature t j ? 40 to 150 c storage temperature range t stg ? 40 to 150 c note 1: ta = 66c: device mounted on a glass-epoxy board (board size: 50 mm 50 mm, soldering land: 6 mm 6 mm) rectangular waveform ( = 180), v r = 10 v note 2: using continuously under h eavy loads (e.g. the application of high temperature/current/voltage and t he significant change in temperature, etc.) may cause this product to decrease in the reliability significantly ev en if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). unit: mm anode cathode 0.13 1.9 0.1 2.5 0.2 0 ~ 0.05 0.5 0.1 0.6 0.1 + 0.2 ? 0.1 1.25 0.88 0.1 0.6 0.1 0.6 0.1 0.6 0.1 1.4 0.2 0.88 0.1 0.78 0.1 + 0.05 ? 0.03 jedec ? jeita ? toshiba 3-2b1a weight: 0.004 g (typ.)
CUS06 2010-02-01 2 electrical characteristics (ta = 25c) characteristics symbol test condition min typ. max unit v fm (1) i fm = 0.1 a ? 0.35 ? v fm (2) i fm = 0.7 a ? 0.42 0.45 peak forward voltage v fm (3) i fm = 1.0 a ? 0.47 ? v i rrm (1) v rrm = 5 v ? 0.7 ? a repetitive peak reverse current i rrm (2) v rrm = 20 v ? 3.0 30 a junction capacitance c j v r = 10 v, f = 1.0 mhz ? 40 ? pf device mounted on a ceramic board (board size: 50 mm 50 mm) (soldering land: 2 mm 2 mm) (board thickness: 0.64 mm) ? ? 75 thermal resistance (junction to ambient) r th (j-a) device mounted on a glass-epoxy board (board size: 50 mm 50 mm) (soldering land: 6 mm 6 mm) (board thickness: 1.6 mm) ? ? 150 c/w thermal resistance (junction to lead) r th (j- ? ) junction to lead of cathode side ? ? 30 c/w marking abbreviation code part no. 6 CUS06 standard soldering pad handling precaution schottky barrier diodes have reverse current ch aracteristic compared to the other diodes. there is a possibility sbd may cause th ermal runaway when it is used under high temperature or high voltage. this device is v f -i rrm trade-off type, lower v f higher i rrm ; therefore, thermal r unaway might occur when voltage is applied. please take forward and re verse loss into consideration during the design. the absolute maximum ratings are rated values and must not be exceeded during operatio n, even for an instant. the following are the general derating methods that we recommend for designing a circuit using this device. v rrm : use this rating with reference to the above. v rrm has a temperature coefficient of 0.1%/c. take this temperature coefficient into account designing a device at low temperature. i f(av) : we recommend that the worst case current be no greater than 80% of the absolute maximum rating of i f(av) and t j be below 120c. when using this device, take the margin into consideration by using an allowable tamax-i f(av) curve. i fsm : this rating specifies the non-repetitive peak curren t. this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. t j : derate this rating when using a device in order to ensure high reliability. we recommend that the device be used at t j of below 120c. thermal resistance between junction and ambient fluctuat es depending on the device?s mounting condition. when using a device, please design a circuit board and a solderin g land size to match the appropriate thermal resistance value. refer to the rectifiers databook for further information. unit: mm 2.0 1.1 0.5 0.8 0.8
CUS06 2010-02-01 3 0 0 160 0.2 0.4 0.6 1.0 1.2 60 20 40 80 100 0.8 1.4 1.6 120 dc = 60 140 120 180 160 0 0 0.2 0.4 0.6 1.0 1.2 80 20 40 100 120 0.8 1.4 1.6 140 180 120 dc = 60 60 0 0 160 0.2 0.4 0.6 1.0 1.2 60 20 40 80 100 0.8 1.4 1.6 120 dc = 60 140 120 180 0.6 0 0 0.2 0.4 0.6 1.0 1.2 0.8 1.4 1.6 0.3 0.1 0.2 0.4 180 120 dc = 60 0.5 0.01 0 75c 25c t j = 150c 10 1 0.1 0.2 0.4 0.6 0.8 1.0 100c maximum allowable lead temperature t ? max (c) instantaneous forward voltage v f (v) i f ? v f instantaneous forward current i f (a) average forward current i f (av) (a) p f (av) ? i f (av) average forward power dissipation p f (av) (w) average forward current i f (av) (a) ta m a x ? i f (av) maximum allowable ambient temperature ta m a x ( c ) average forward current i f (av) (a) t ? max ? i f (av) rectangular waveform 0 360 conduction angle: device mounted on a ceramic board (board size: 50 mm 50 mm) (soldering land: 2 mm 2 mm) rectangular waveform conduction angle: v r = 10 v i f ( av ) 0 360 rectangular waveform 0 360 conduction angle: v r = 10 v i f ( av ) number of cycles surge forward current (non-repetitive) peak surge forward current i fsm (a) average forward current i f (av) (a) ta m a x ? i f (av) maximum allowable ambient temperature ta m a x ( c ) device mounted on a glass-epox y board (board size: 50 mm 50 mm) (soldering land: 6 mm 6 mm) rectangular waveform 0 360 conduction angle: v r = 10 v i f ( av ) 0 1 ta = 2 5 c f = 50 hz 24 10 100 20 16 12 8 4
CUS06 2010-02-01 4 1 100 1000 0.001 1000 1 0.01 0.1 10 100 10 10000 ( 1 ) (2) ( 3 ) 0.3 0 0 8 12 20 0.2 120 60 180 300 240 dc 0.1 4 16 15 v v r =20 v 0.0001 0 100 1 0.01 10 5 v 3 v 10 v 40 120 160 20 100 140 60 80 0.1 0.001 average reverse power dissipation p r (av) (w) reverse voltage v r (v) c j ? v r (typ.) junction capacitance c j (pf) junction temperature t j (c) i r ? t j (typ.) reverse current i r (ma) reverse voltage v r (v) p r (av) ? v r (typ.) pulse test rectangular waveform conduction angle: t j = 150c 0 360 transient thermal impedance r th (j-a) (c/w) time t (s) r th (j-a) ? t (1) device mounted on a ceramic board soldering land: 2 mm 2 mm (2) device mounted on a glass-epoxy board soldering land: 6 mm 6 mm (3) device mounted on a glass-epoxy board standard soldering pad 1000 10 f = 1 mhz ta = 25c 100 1 10 100
CUS06 2010-02-01 5 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? 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